Part # 2956418

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Bogen Communications

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Description: Bogen® Tile Bridge Small Footprint, 10 in W x 24 in D x 1/2 in H

Manufacturer PN: TBSF

UPC: 76536810044

Kendall Electric Inc PN: 2956418

Invoice Description:

TBSF BOGEN TILE BRIDGE SMALL FOOTPRINT

SPEC SHEET

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Bogen® TBSF Tile Bridge Small Footprint

Note: Lead times are estimates only

Description Specifications Features Resources

Description

This Bogen Tile Bridge Support (Model TBSF) is designed to offer additional mounting support for the Bogen High-Fidelity, Small-Footprint Speaker (Model HFSF1) and Compact Ceiling Speaker (Model SEC4T) when mounted in a suspended ceiling installation.

Bogen® Tile Bridge Small Footprint, 10 in W x 24 in D x 1/2 in H

Specifications

Brand Name	Bogen®
Dimensions	10 in W x 24 in D x 1/2 in H
Manufacturer Part Number	TBSF
PART NUMBER KEYWORDS	TBSF ; 765368100440 ; 76536810044

Features

▪ Remove the tile from the ceiling and put the TBSFon top of the ceiling tile, aligning the ends of the TBSFrails as shown in the drawing at right

▪ Typically the ceiling speaker will be mounted in the center of the ceiling tile. Care must be taken to ensure that the TBSF rails will be flush with the tile sides and that the ring portion will not interfere with the suspension grid

▪ Use the ring as a guide to cut a hole in the ceiling tile

▪ Sandwich the tile between the TBSFand the front bezel of the speaker and secure the speaker clamps

▪ Complete speaker installation and connections as directed in the speaker instruction manual